The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Aug. 03, 2012
Applicants:

Peter A. Gruber, Mohegan Lake, NY (US);

Jae-woong Nah, Closter, NJ (US);

Inventors:

Peter A. Gruber, Mohegan Lake, NY (US);

Jae-Woong Nah, Closter, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); B23K 3/06 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); B23K 1/00 (2006.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); B23K 26/383 (2013.01); B23K 26/385 (2013.01); B23K 26/4085 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); B23K 2201/42 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/111 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/11005 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/11436 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13551 (2013.01); H01L 2224/13561 (2013.01); H01L 2224/81101 (2013.01); H01L 2224/81191 (2013.01);
Abstract

A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate.


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