The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Nov. 18, 2019
International Business Machines Corporation, Armonk, NY (US);
Jae-Woong Nah, Closter, NJ (US);
Stephen L. Buchwalter, Anthem, AZ (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Paul Alfred Lauro, Brewster, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.