The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Aug. 28, 2013
International Business Machines Corporation, Armonk, NY (US);
Jae-Woong Nah, Armonk, NY (US);
Da-Yuan Shih, Armonk, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of assembling a semiconductor flip chip comprising a wafer having solderable electrical conducting sites and a substrate having electrical connecting pads and electrically conductive posts operatively associated with the pads and extending away from the pads to terminate in distal ends, comprises the pre-assembly steps of solder bumping the distal ends through openings in a solder mask by injection molding solder onto the distal ends so that the distal ends extend into the mask through the openings to produce a solder bumped substrate, and soldering the solder bumped substrate to the sites.