Jeremy Alfred Theil

Title: Jeremy Alfred Theil: The Ingenious Patent Innovator

Introduction:

Jeremy Alfred Theil, based in Mountain View, California, is a highly accomplished inventor and patent holder with a remarkable portfolio of 33 patents. His groundbreaking work in chemical mechanical polishing for hybrid bonding and low temperature bonded structures has made a significant impact in the field of integrated circuit manufacturing. Let's delve deeper into his innovative contributions, notable patents, and his associations with esteemed companies and coworkers.

Notable Patents:

Among Jeremy Alfred Theil's impressive list of patents, two stand out for their innovative solutions: "Chemical mechanical polishing for hybrid bonding" and "Low temperature bonded structures."

1. Chemical Mechanical Polishing for Hybrid Bonding:

Jeremy's patent focuses on a technique that utilizes chemical mechanical polishing (CMP) to achieve hybrid bonding in integrated circuit manufacturing. This method involves depositing and patterning a dielectric layer on a substrate to create openings, followed by depositing a barrier layer and a conductive structure within the openings. The conductive structure is then polished, revealing portions of the barrier layer. The barrier layer is subsequently polished with a selective polish, exposing a bonding surface on the dielectric layer. This patent is a testament to Jeremy's expertise in resolving critical manufacturing challenges.

2. Low Temperature Bonded Structures:

Jeremy's second notable patent illustrates his prowess in using recesses within conductive interconnect structures to form reliable low temperature metallic bonds. This technique involves depositing a fill layer into the recesses before bonding. By employing direct bonding techniques, first conductive interconnect structures smoothly bond at ambient temperatures with second metallic interconnect structures. The fill layers in the recesses enhance the bonding process, resulting in robust low temperature bonded structures.

Professional Journey and Associations:

Throughout his career, Jeremy Alfred Theil has contributed his invaluable expertise to prominent companies such as Agilent Technologies, Inc. and Hewlett-Packard Company (HP). At these organizations, he has undoubtedly played a pivotal role in advancing their research and development endeavors. His collaboration with esteemed coworkers Min Cao and Gary William Ray further highlights his ability to work successfully within a team environment, fostering collaborative innovation.

Conclusion:

Jeremy Alfred Theil's exceptional talent and dedication to innovation have propelled him to become a distinguished inventor in the field of integrated circuit manufacturing. His patents, particularly in chemical mechanical polishing for hybrid bonding and low temperature bonded structures, exemplify his ability to tackle complex challenges and develop inventive solutions. By working with industry-leading companies and talented coworkers, Jeremy continues to make significant contributions to technological advancements in the field.