The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Oct. 27, 2022
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Jeremy Alfred Theil, Mountain View, CA (US);
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Dominik Suwito, San Jose, CA (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
Disclosed herein are methods for direct bonding. In some embodiments, the direct bonding method includes providing a first element having a first bonding surface, providing a second element having a second bonding surface, slightly etching the first bonding surface, treating the first bonding surface with a terminating liquid treatment to terminate the first bonding surface with a terminating species, and directly bonding the first bonding surface to the second bonding surface without the use of an intervening adhesive and without exposing the first bonding surface to plasma.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile