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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12598962 B1

PDFFull Text
Date of Patent:
Apr. 07, 2026

Filed:

Mar. 14, 2023

System and method for bonding transparent conductor substrates

Applicant:

Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);

Inventors:

Jeremy Alfred Theil, Mountain View, CA (US);

Cyprian Emeka Uzoh, San Jose, CA (US);

Gaius Gillman Fountain, Jr., Youngsville, NC (US);

Belgacem Haba, Saratoga, CA (US);

Rajesh Katkar, Milpitas, CA (US);

Assignee:

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US);

Attorney:

Knobbe, Martens, Olson & Bear, LLP

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/027 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/52 (2006.01); H01L 25/16 (2023.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 21/0273 (2013.01); H01L 21/561 (2013.01); H01L 23/12 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/96 (2013.01); H01L 25/162 (2013.01); H01L 25/167 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03831 (2013.01); H01L 2224/03845 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80948 (2013.01); H01L 2224/96 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01);
Abstract

An element includes a substrate and a surface layer on the substrate. The surface layer includes at least one first region comprising an optically transparent and electrically insulative first material and at least one second region at least partially embedded in the at least one first region. The at least one second region comprises an optically transparent and electrically conductive second material.

Find Patent Forward Citations

Theil, Jeremy. (2026). System and method for bonding transparent conductor substrates (U.S. Patent No. 12598962). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12598962

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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