The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Oct. 11, 2023
Adeia Semiconductor Bonding Technologies, Inc., San Jose, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Adeia Semiconductor Bonding Technologies, Inc., San Jose, CA (US);
Abstract
A first conductive feature of a first substrate is bonded to a second conductive feature of a second substrate. The first conductive feature is formed by depositing a conductive base layer on the first substrate, the first substrate having an opening formed therein, recessing the conductive base layer in the opening, and depositing a conductive surface layer on the recessed conductive base layer. Hybrid bonding of the first substrate to the second substrate is performed without use of an intervening adhesive to connect the first conductive feature and the second conductive feature.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile