North Bend, WA, United States of America

Joseph Charles Fjelstad

This inventor holds 183 USPTO granted patents and 13 published patent applications and 1 EPO patent, primarily in Solder-Free Electronics (CPC class H01L2-144). Top assignees: Adeia Semiconductor Bonding Technologies Inc., Interconnect Portfolio LLC, Silicon Pipe, Inc.. Active years: 1997-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joseph Charles Fjelstad. Retrieved from https://idiyas.com/inventor/joseph-charles-fjelstad

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 183 

% Patents Active = 77.6


Average Co-Inventor Count = 1.7

ph-index = 46

Forward Citations = 7,037(Granted Patents)

Forward Citations (Not Self Cited) = 6,865(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Sunnvale, CA (US) (2004)
  • Maple Valley, CA (US) (2005 - 2007)
  • Sunnyvale, CA (US) (1997 - 2011)
  • Maple Valley, WA (US) (2003 - 2019)
  • North Bend, WA (US) (2016 - 2019)

Company Filing History:


Years Active: 1997-2019

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Areas of Expertise:
Solder-Free Electronics
Flexible Circuit Assembly
IC Packaging
Thermal Management
Electronic Assemblies
Compliant Layers
Connector Constructions
High-Speed Connectors
ESD Protection
Memory IC Package
Stackable Lead Frame
183 patents (USPTO):Explore Patents

Title: Joseph Fjelstad: Revolutionizing the Electronics Manufacturing Industry

Introduction:

Joseph Fjelstad, based in Maple Valley, WA, has made remarkable contributions to the electronics manufacturing industry throughout his career. With an extensive portfolio boasting 150 patents, Fjelstad's innovative solutions have played a pivotal role in advancing the field. Let's delve into his latest patents, career highlights, notable collaborations, and the lasting impact of his pioneering work.

Latest Patents:

Among Joseph Fjelstad's recent patents, two stand out as groundbreaking advancements in the field of electronics manufacturing:

1. Solder Alloy Free Electronic (Safe) Rigid-Flexible/Stretchable Circuit Assemblies: This patent covers the development of rigid-flex circuits composed of high thermal conductivity sections. By eliminating the need for solder, Fjelstad's innovation provides a safer and more reliable method for interconnecting components directly to the traces. Additionally, the thermally conductive sections are interconnected through flexible circuit sections, facilitating greater versatility in circuit design.

2. Occam Process for Components Having Variations in Part Dimensions: Fjelstad's Occam process revolutionizes solderless manufacturing by enabling the connection of components to circuits without relying on solder. The process utilizes a component support fixture that accommodates components of varying sizes, employing oversized compartments and vent holes to ensure proper alignment and secure connections. This patent enhances manufacturing efficiency while guaranteeing long-lasting and robust electronic assemblies.

Career Highlights:

During his illustrious career, Joseph Fjelstad has achieved numerous milestones and garnered recognition for his contributions to the electronics manufacturing industry. Some notable career highlights include:

1. Tessera, Inc.: Fjelstad held a key position at Tessera, Inc., where he contributed to the development of advanced packaging technologies and flexible circuit solutions. His work played a significant role in improving the reliability and performance of electronic devices.

2. Interconnect Portfolio LLC: Fjelstad's expertise extended to Interconnect Portfolio LLC, where he continued to drive innovation in electronic interconnect technologies. His contributions were instrumental in developing cutting-edge solutions to meet the industry's evolving needs.

Collaborations:

Joseph Fjelstad has had the opportunity to collaborate with highly respected professionals in the field. Notable coworkers include:

1. John W Smith: Fjelstad worked alongside John W Smith, a recognized expert in electronic manufacturing and packaging. Their collaboration likely contributed to the development of groundbreaking technologies and solutions.

2. Kevin P Grundy: Fjelstad's collaboration with Kevin P Grundy, an industry veteran, would have bolstered their collective expertise in advancing electronic interconnect technologies.

Conclusion:

Joseph Fjelstad's remarkable career and numerous contributions have significantly shaped the electronics manufacturing industry. With 150 patents to his name, Fjelstad's innovations have revolutionized circuit assembly, laying the foundation for safer, more reliable, and versatile electronic devices. Through his work at Tessera, Inc., Interconnect Portfolio LLC, and collaborations with industry experts, Fjelstad's impact on the field is profound. As a true pioneer, Fjelstad continues to inspire and push the boundaries of what is possible in electronics manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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