For the Inventor, By the Inventor

Enter assignee name

San Jose, CA, United States of America

Silicon Pipe, Inc.

USPTO Granted Patents = 16

Forward Citations = 386

Loading Chart...

Loading Chart...

10 inventors (with patents filed for the assignee):

Joseph Charles Fjelstad (14 out of 183 patents)

Kevin P Grundy (10 out of 40 patents)

Para Kanagasabai Segaram (9 out of 28 patents)

4. Belgacem Haba (4 out of 645 patents)

5. William F Wiedemann (4 out of 18 patents)

6. Gary Yasumura (4 out of 26 patents)

7. Inessa Obenhuber, Legal Representative (2 out of 8 patents)

8. Matthew J Stepovich (1 out of 11 patents)

9. Thomas J Obenhuber (1 out of 11 patents)

10. Para K Segaram (1 out of 15 patents)

16 patents: Sort by Forward Citations

1. 7310239 - IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader (2007-12-18),

2. 7308524 - Memory chain (2007-12-11),

3. 7307293 - Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths (2007-12-11),

4. 7280372 - Stair step printed circuit board structures for high speed signal transmissions (2007-10-09),

5. 7279783 - Partitioned integrated circuit package with central clock driver (2007-10-09),

6. 7278855 - High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture (2007-10-09),

7. 7227759 - Signal-segregating connector system (2007-06-05),

8. 7205613 - Insulating substrate for IC packages having integral ESD protection (2007-04-17),

9. 7192320 - Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity (2007-03-20),

10. 7111108 - Memory system having a multiplexed high-speed channel (2006-09-19),

11. 7061096 - Multi-surface IC packaging structures and methods for their manufacture (2006-06-13),

12. 7014472 - System for making high-speed connections to board-mounted modules (2006-03-21),

13. 6933610 - Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby (2005-08-23),

14. 6891272 - Multi-path via interconnection structures and methods for manufacturing the same (2005-05-10),

15. 6884120 - Array connector with deflectable coupling structure for mating with other components (2005-04-26),

Silicon Pipe, Inc. is a technology company specializing in the development of high-performance data solutions. Our cutting-edge products and services help businesses optimize their data pipelines, improve processing efficiency, and enable advanced analytics. With a focus on reliability, scalability, and innovation, our team of experts delivers robust solutions that meet the evolving needs of our clients. For more information, please visit our website.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 16 2025

16 Patents

#371 in

#19,280 in

#36,651 in the World

San Jose, CA, United States of America

Silicon Pipe, Inc.

Forward Citations = 386

10 inventors:

Joseph Charles Fjelstad (14 out of 183 patents)

Kevin P Grundy (10 out of 40 patents)

Para Kanagasabai Segaram (9 out of 28 patents)

4. Belgacem Haba (4 out of 645 patents)

5. William F Wiedemann (4 out of 18 patents)

Please report any incorrect information to support@idiyas.com

Loading…