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San Jose, CA, United States of America

Silicon Pipe, Inc.

Calculating rank

USPTO Granted Patents = 16

% Expired Patents = 12.5

Forward Citations = 391

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10 inventors (with patents filed for the assignee):

Joseph Charles Fjelstad (14 out of 183 patents)

Kevin P Grundy (10 out of 40 patents)

Para Kanagasabai Segaram (9 out of 28 patents)

4. Belgacem Haba (4 out of 672 patents)

5. William F Wiedemann (4 out of 18 patents)

6. Gary Yasumura (4 out of 26 patents)

7. Inessa Obenhuber, Legal Representative (2 out of 8 patents)

8. Matthew J Stepovich (1 out of 11 patents)

9. Thomas J Obenhuber (1 out of 11 patents)

10. Para K Segaram (1 out of 16 patents)

16 patents: Sort by Forward Citations

1. 7310239 - IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader (2007-12-18),

2. 7308524 - Memory chain (2007-12-11),

3. 7307293 - Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths (2007-12-11),

4. 7280372 - Stair step printed circuit board structures for high speed signal transmissions (2007-10-09),

5. 7279783 - Partitioned integrated circuit package with central clock driver (2007-10-09),

6. 7278855 - High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture (2007-10-09),

7. 7227759 - Signal-segregating connector system (2007-06-05),

8. 7205613 - Insulating substrate for IC packages having integral ESD protection (2007-04-17),

9. 7192320 - Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity (2007-03-20),

10. 7111108 - Memory system having a multiplexed high-speed channel (2006-09-19),

11. 7061096 - Multi-surface IC packaging structures and methods for their manufacture (2006-06-13),

12. 7014472 - System for making high-speed connections to board-mounted modules (2006-03-21),

13. 6933610 - Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby (2005-08-23),

14. 6891272 - Multi-path via interconnection structures and methods for manufacturing the same (2005-05-10),

15. 6884120 - Array connector with deflectable coupling structure for mating with other components (2005-04-26),

Company Overview

Silicon Pipe, Inc. is a technology company based in San Jose, California, specializing in advanced semiconductor solutions. The organization focuses on the development and manufacturing of innovative materials and components that enhance the performance and efficiency of electronic devices. With a strong emphasis on research and development, Silicon Pipe aims to drive advancements in various sectors, including telecommunications and consumer electronics, contributing to the evolution of next-generation technologies.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

16 Patents

#397 in

#19,944 in

#37,887 in the World

San Jose, CA, United States of America

Silicon Pipe, Inc.

Forward Citations = 391

10 inventors:

Joseph Charles Fjelstad (14 out of 183 patents)

Kevin P Grundy (10 out of 40 patents)

Para Kanagasabai Segaram (9 out of 28 patents)

4. Belgacem Haba (4 out of 672 patents)

5. William F Wiedemann (4 out of 18 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Silicon Pipe, Inc.. Retrieved from https://idiyas.com/company/silicon-pipe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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