The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Sep. 23, 2004
Applicants:
Joseph C Fjelstad, Maple Valley, WA (US);
Para K. Segaram, Brookfield, AU;
Inessa Obenhuber, Legal Representative, San Francisco, CA (US);
Kevin P. Grundy, Fremont, CA (US);
Inventors:
Joseph C Fjelstad, Maple Valley, WA (US);
Para K. Segaram, Brookfield, AU;
Inessa Obenhuber, legal representative, San Francisco, CA (US);
Kevin P. Grundy, Fremont, CA (US);
Assignee:
Silicon Pipe, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.