Brookfield, Australia

Para Kanagasabai Segaram

USPTO Granted Patents = 28 

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 420(Granted Patents)


Location History:

  • Campbell, CA (US) (2005 - 2006)
  • Cupertino, CA (US) (2006 - 2012)
  • Brookfield, AU (2006 - 2013)

Company Filing History:


Years Active: 2005-2013

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28 patents (USPTO):Explore Patents

Title: Innovations and Achievements of Para Kanagasabai Segaram

Introduction: Para Kanagasabai Segaram is a prominent inventor based in Brookfield, Australia, recognized for his innovative contributions to the field of electronics. With an impressive portfolio of 28 patents, Segaram has made significant strides in improving interconnection technologies that enhance the performance and efficiency of electronic devices.

Latest Patents: Segaram's latest patents are a testament to his ingenuity and expertise. One of his notable inventions is the "Multi-surface IC packaging structures," which introduces an integrated circuit (IC) package with multiple surfaces for interconnection. This design allows for connections from the IC chip to the input/output terminations of the package assembly across more than one surface, facilitating interconnections to other devices or assemblies that may be spatially separated. Another significant patent is for "Low profile discrete electronic components and applications of same," which discloses structures suitable for vertical interconnection within electronic substrates. This innovation enhances placement options for electronic components and contributes to streamlined IC packaging.

Career Highlights: Segaram's career features key positions at influential companies such as Interconnect Portfolio LLC and Silicon Pipe, Inc. His work has not only advanced his own projects but has also had a lasting impact on the electronic industry. His innovative approaches continue to push the boundaries of technology, thereby enhancing the capabilities of modern electronic devices.

Collaborations: Throughout his career, Segaram has collaborated with esteemed professionals in the field, including Kevin P. Grundy and Joseph Charles Fjelstad. These partnerships have fostered an environment of creativity and innovation, enabling the development of groundbreaking technologies that address complex challenges in electronic interconnection.

Conclusion: Para Kanagasabai Segaram's contributions to the field of electronics through his extensive patent portfolio have established him as a key player in the industry. His latest inventions demonstrate his commitment to advancing technology and are sure to influence future developments. As he continues to innovate, the impact of his work will likely resonate across various sectors within the electronic landscape.

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