Brookfield, Australia

Para Kanagasabai Segaram

This inventor holds 28 USPTO granted patents and 2 published patent applications, primarily in Electrical Connectors. Top assignees: Interconnect Portfolio LLC, Silicon Pipe, Inc., Samsung Electronics Co., Ltd.. Active years: 2005-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Para Kanagasabai Segaram. Retrieved from https://idiyas.com/inventor/para-kanagasabai-segaram

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 28 

% Patents Active = 71.4

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 422(Granted Patents)


Location History:

  • Campbell, CA (US) (2005 - 2006)
  • Cupertino, CA (US) (2006 - 2012)
  • Brookfield, AU (2006 - 2013)

Company Filing History:


Years Active: 2005-2013

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Areas of Expertise:
Multi-Surface IC Packaging
Electrical Connectors
High-Speed Connections
Memory Systems
Torsionally-Induced Conductors
Signal Integrity
Daisy-Chained Memory
Discrete Electronic Components
Tapered Dielectric Structures
Connector Systems
Interconnect Systems
Integrated Circuit Package
28 patents (USPTO):Explore Patents

Title: Innovations and Achievements of Para Kanagasabai Segaram

Introduction: Para Kanagasabai Segaram is a prominent inventor based in Brookfield, Australia, recognized for his innovative contributions to the field of electronics. With an impressive portfolio of 28 patents, Segaram has made significant strides in improving interconnection technologies that enhance the performance and efficiency of electronic devices.

Latest Patents: Segaram's latest patents are a testament to his ingenuity and expertise. One of his notable inventions is the "Multi-surface IC packaging structures," which introduces an integrated circuit (IC) package with multiple surfaces for interconnection. This design allows for connections from the IC chip to the input/output terminations of the package assembly across more than one surface, facilitating interconnections to other devices or assemblies that may be spatially separated. Another significant patent is for "Low profile discrete electronic components and applications of same," which discloses structures suitable for vertical interconnection within electronic substrates. This innovation enhances placement options for electronic components and contributes to streamlined IC packaging.

Career Highlights: Segaram's career features key positions at influential companies such as Interconnect Portfolio LLC and Silicon Pipe, Inc. His work has not only advanced his own projects but has also had a lasting impact on the electronic industry. His innovative approaches continue to push the boundaries of technology, thereby enhancing the capabilities of modern electronic devices.

Collaborations: Throughout his career, Segaram has collaborated with esteemed professionals in the field, including Kevin P. Grundy and Joseph Charles Fjelstad. These partnerships have fostered an environment of creativity and innovation, enabling the development of groundbreaking technologies that address complex challenges in electronic interconnection.

Conclusion: Para Kanagasabai Segaram's contributions to the field of electronics through his extensive patent portfolio have established him as a key player in the industry. His latest inventions demonstrate his commitment to advancing technology and are sure to influence future developments. As he continues to innovate, the impact of his work will likely resonate across various sectors within the electronic landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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