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For the Inventor, By the Inventor

Campbell, CA, United States of America

William F Wiedemann

This inventor holds 18 USPTO granted patents and 2 published patent applications, primarily in Electrical Connectors. Top assignees: Interconnect Portfolio LLC, Samsung Electronics Co., Ltd., Silicon Pipe, Inc.. Active years: 2007-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William F Wiedemann. Retrieved from https://idiyas.com/inventor/william-f-wiedemann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 88.9

Average Co-Inventor Count = 4.9

ph-index = 7

Forward Citations = 356(Granted Patents)


Company Filing History:

goldMedal10 out of 17 
 
Interconnect Portfolio LLC
 patents
silverMedal4 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
bronzeMedal4 out of 16 
 
Silicon Pipe, Inc.
 patents

Years Active: 2007-2012

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Areas of Expertise:
Cabled Signaling System
Discrete Electronic Components
Electrical Connector
Signal Integrity
High Speed Connectors
Torsionally-Induced Conductors
Interconnect System
Multi-Surface Contact
Capacitive Stubs
Printed Circuit Board
Signal-Segregating Connector
18 patents (USPTO):Explore Patents
1. 8338713 - Cabled signaling system and components thereof (2012-12-25),
2. 8324727 - Low profile discrete electronic components and applications of same (2012-12-04),
3. 8079848 - Electrical connector with conductors with a ramp to induce torsion (2011-12-20),
4. 8047855 - High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture (2011-11-01),
5. 7909615 - Torsionally-induced contact-force conductors for electrical connector systems (2011-03-22),
6. 7845986 - Torsionally-induced contact-force conductors for electrical connector systems (2010-12-07),
7. 7837477 - Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity (2010-11-23),
8. 7732904 - Multi-surface contact IC packaging structures and assemblies (2010-06-08),
9. 7701323 - Low profile discrete electronic components and applications of same (2010-04-20),
10. 7652381 - Interconnect system without through-holes (2010-01-26),
11. 7651382 - Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity (2010-01-26),
12. 7651336 - High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture (2010-01-26),
13. 7613011 - Signal-segregating connector system (2009-11-03),
14. 7404746 - Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity (2008-07-29),
15. 7280372 - Stair step printed circuit board structures for high speed signal transmissions (2007-10-09),

Title: The Innovative Journey of William F. Wiedemann

Introduction: William F. Wiedemann is a pioneering inventor based in Campbell, California, whose creative spirit and dedication to innovation have led to remarkable contributions in the field of technology.

Latest Patents: William F. Wiedemann holds several patents in various technological domains, showcasing his versatility and ingenuity in creating novel solutions to complex problems.

Career Highlights: Throughout his illustrious career, William F. Wiedemann has been at the forefront of technological advancements, with a focus on developing cutting-edge inventions that have the potential to revolutionize industries.

Collaborations: William F. Wiedemann has collaborated with leading experts in the field, fostering a culture of innovation and knowledge-sharing that has propelled his inventions to new heights of success.

Conclusion: William F. Wiedemann's relentless pursuit of innovation and his passion for creating groundbreaking solutions make him a true visionary in the world of technology, inspiring future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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