The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2008

Filed:

Dec. 01, 2006
Applicants:

Gary Yasumura, Santa Clara, CA (US);

Joseph C. Fjelstad, Maple Valley, WA (US);

Kevin P. Grundy, Fremont, CA (US);

William F. Wiedemann, Campbell, CA (US);

Matthew J. Stepovich, Santa Cruz, CA (US);

Inventors:

Gary Yasumura, Santa Clara, CA (US);

Joseph C. Fjelstad, Maple Valley, WA (US);

Kevin P. Grundy, Fremont, CA (US);

William F. Wiedemann, Campbell, CA (US);

Matthew J. Stepovich, Santa Cruz, CA (US);

Assignee:

Interconnect Portfolio, LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.


Find Patent Forward Citations

Yasumura, Gary. (2008). Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity (U.S. Patent No. 7404746). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7404746

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…