Interconnect Portfolio LLC

Samsung Electronics Co., Ltd.

Silicon Pipe, Inc.

William F Wiedemann

Joseph Charles Fjelstad

Kevin P Grundy

Para Kanagasabai Segaram

Gary Yasumura

Thomas J Obenhuber

Matthew J Stepovich

Inessa Obenhuber, Legal Representative

Gary Yasamura

Para K Segaram

An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.

Cabled signaling system and components thereof

Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.

Low profile discrete electronic components and applications of same

An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Electrical connector with conductors with a ramp to induce torsion

An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Torsionally-induced contact-force conductors for electrical connector systems

An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.

Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity

A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.

Multi-surface contact IC packaging structures and assemblies

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Interconnect system without through-holes

A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Growing community of inventors

Campbell, CA, United States of America

William F Wiedemann