Adeia Semiconductor Bonding Technologies Inc.

Interconnect Portfolio LLC

Silicon Pipe, Inc.

Samsung Electronics Co., Ltd.

Occam Portfolio LLC

Other

Google Inc.

Tesseva, Inc.

Joseph Charles Fjelstad

Thomas H DiStefano

John W Smith

Kevin P Grundy

Konstantine N Karavakis

Para Kanagasabai Segaram

William F Wiedemann

Gary Yasumura

Belgacem Haba

Thomas J Obenhuber

Inessa Obenhuber, Legal Representative

A Christian Walton

Masud Beroz

Zlata Kovac

Matthew J Stepovich

Christopher M Pickett

James B Zaccardi

David Noel Light

Para K Segaram

Anthony B Faraci

Craig S Mitchell

Owais Jamil

Pieter H Bellaar

Gary Yasamura

Wael Zohni

Suresh Rajan

David T Wang

Michael John Sebastian Smith

Philip Damberg

Philip Arnold Ferolito

Daniel L Rosenband

William P Schmidt

Michael Warner

Jeremy Werner

John B Riley, Iii

Jeremy Plunkett

Tan Nguyen

Nader Gamini

William F Wiedermann

John Myers

A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.

Solder alloy free electronic (SAFE) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture

Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture

Backgammon board

An Occam process (solderless manufacturing) that employs a component support fixture that provides permanent or temporary support for components during subsequent processing in a solderless process for electrically connecting the components to circuits. The component support fixture provides oversized compartments for housing the components which may have varying sizes. The compartments are provided with vent holes or apertures for venting air or excess glue as the component support is pressed against the components during manufacture.

Occam process for components having variations in part dimensions

Ellipsoid based gaming die having five flatted surfaces

Ellipsoidal gaming die having five flatted surfaces

Ellipsoidal gaming die having three flatted surfaces

A framecontaining aperture(s)is positioned on and joined to a permanent substrateor temporary substrate. Electrical component(s)are placed into respective aperture(s)with the leadsof the component(s)positioned on and attached to the permanent substrateor the temporary substrate. Then an encapsulant, electrically insulating, but preferably thermally conductive, envelops the component(s). At this point, temporary substratemay be removed exposing component leads. Or, if component(s)are mounted on permanent substrate, viasextend from the surface of substrateto leads. With leadsexposed, the completed subassemblymay be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.

Method of making a circuit subassembly

Sphere based game die having 20 flatted surfaces

Sphere based die having 6 flatted surfaces

In an embodiment, an IC assembly comprises an IC having a top surface comprising a plurality of input/output terminations, a plurality of leads arranged around the IC, a plurality of bond wires, and an encapsulant. Each lead has a first surface and a second surface opposite the first surface, and has a feature protruding from the first surface proximate an inward end of the lead nearest the IC. The feature extends from the first surface to approximately a plane that includes a bottom surface of the IC. Each bond wire connects a respective lead to a respective I/O terminal on the IC. The encapsulant seals the bond wires, the IC, and a first portion of the leads that includes the feature. The feature creates on offset from the bottom of the IC to permit the encapsulant to surround the first portion.

Stackable low-profile lead frame package

An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Multi-surface IC packaging structures

A method of making a semiconductor chip package is provided in which a compliant layer is provided over a contact bearing face of a semiconductor chip. The compliant layer can have a bottom surface adjacent to the chip face, a top surface facing away from the bottom surface, and at least one sloping surface between the top and bottom surfaces. The compliant layer can be disposed remote in a lateral direction along the contact bearing face from at least one contact adjacent to the sloping surface. Bond ribbons can be formed atop the compliant layer, wherein each bond ribbon electrically connects one of the contacts to an associated conductive terminal at the top surface of the compliant layer. The compliant layer can provide stress relief to the bond ribbons, such as during handling and affixing the assembly to an external substrate. A bond ribbon can include a strip extending along the sloping surface of the compliant layer, the strip having a substantially constant thickness in a direction extending away from the sloping surface.

Methods of making compliant semiconductor chip packages

A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.

Electronic assemblies without solder and methods for their manufacture

A microelectronic unit can include a support structure including a dielectric having oppositely-directed first and second surfaces. A plurality of substantially rigid posts can protrude parallel to one another in a direction beyond the first surface of the support structure. Each post may have a top surface remote from the support structure, and the top surfaces can be substantially coplanar with one another. A microelectronic device having a surface with bond pads can overlie the second surface of the support structure with the bond pad-bearing surface of the microelectronic device facing toward the support structure. Connections can electrically connect the posts with the bond pads.

Method of electrically connecting a microelectronic component

Growing community of inventors

North Bend, WA, United States of America

Joseph Charles Fjelstad