The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Sep. 09, 2011
Applicant:
Joseph Charles Fjelstad, Maple Valley, WA (US);
Inventor:
Joseph Charles Fjelstad, Maple Valley, WA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); B32B 37/12 (2006.01); B32B 37/02 (2006.01); B32B 37/14 (2006.01); H05K 1/18 (2006.01); B32B 37/15 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H05K 3/28 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); B32B 37/153 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/93 (2013.01); H01L 25/0655 (2013.01); H05K 3/284 (2013.01); B32B 37/12 (2013.01); B32B 2307/202 (2013.01); B32B 2457/08 (2013.01); B32B 2519/02 (2013.01); H01L 2224/29 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29299 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/83001 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/3025 (2013.01); H05K 3/007 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10719 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0173 (2013.01); H05K 2203/1469 (2013.01);
Abstract
An Occam process (solderless manufacturing) that employs a component support fixture that provides permanent or temporary support for components during subsequent processing in a solderless process for electrically connecting the components to circuits. The component support fixture provides oversized compartments for housing the components which may have varying sizes. The compartments are provided with vent holes or apertures for venting air or excess glue as the component support is pressed against the components during manufacture.