The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Mar. 18, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jay Prakash Gupta, Hillsboro, OR (US);

Souvik Ghosh, Kolkata, IN;

Kimin Jun, Portland, OR (US);

Bhupendra Kumar, Beaverton, OR (US);

Shashi Vyas, Euclid, OH (US);

Anup Pancholi, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03849 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05187 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/8009 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/8083 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80948 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A microelectronic assembly and a method of forming same. The assembly includes: first and second microelectronic structures; and an interface layer between the two microelectronic structures including dielectric portions in registration with dielectric layers of each of the microelectronic structures, and electrically conductive portions in registration with electrically conductive structures of each of the microelectronic structures, wherein the dielectric portions include an oxide of a metal, and the electrically conductive portions include the metal.


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