This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Bhupendra Kumar - Innovator in Microelectronics
Introduction
Bhupendra Kumar is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of microelectronics, particularly through his innovative patent. His work focuses on enhancing the efficiency and functionality of microelectronic assemblies.
Latest Patents
Kumar holds a patent titled "Method of atomic diffusion hybrid bonding and apparatus made from same." This patent describes a microelectronic assembly and a method of forming it. The assembly includes first and second microelectronic structures, along with an interface layer that features dielectric portions in registration with dielectric layers of each microelectronic structure. Additionally, the electrically conductive portions align with the conductive structures of each microelectronic structure. The dielectric portions consist of an oxide of a metal, while the electrically conductive portions include the metal. This innovative approach has the potential to advance microelectronic technology significantly.
Career Highlights
Bhupendra Kumar is currently employed at Intel Corporation, a leading company in the technology sector. His role at Intel allows him to work on cutting-edge projects that push the boundaries of microelectronics. His expertise and innovative mindset contribute to the company's ongoing success in the industry.
Collaborations
Kumar collaborates with Souvik Ghosh, a fellow innovator in the field. Their partnership exemplifies the spirit of teamwork and shared knowledge that drives innovation forward.
Conclusion
Bhupendra Kumar's contributions to microelectronics through his patent and work at Intel Corporation highlight his role as a key innovator in the field. His advancements in microelectronic assemblies pave the way for future developments in technology.