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Hong Kong, China

Chun Ho Fan

USPTO Granted Patents = 51 (Patent Applications = 5)

Average Co-Inventor Count = 2.7

ph-index = 31

Forward Citations = 3,024(Granted Patents)

Forward Citations (Not Self Cited) = 2,963(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hong Kong, CN (2002 - 2018)
Tsuen Wan, CN (2016 - 2018)

Company Filing History:

A-sat Corporation

Ubotic Company Limited

Asm Technology Singapore Pte Ltd

Utac Hong Kong Limited

Utac Headquarters Pte. Ltd.

6. 1 out of 832,843

Other

patents

Years Active: 2002-2018

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Areas of Expertise:

Wafer-Level Semiconductor Packages

Cavity Package

Integrated Circuit Package

Leadless Plastic Chip Carrier

Ball Grid Array Package

Thermal Dissipation

Thermocompression Bonding

Electronic Components

Thin Array Plastic Packages

Die Attach Pad

Mold Warping

Sensor Semiconductor Package

51 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10115579 - Method for manufacturing wafer-level semiconductor packages (2018-10-30),

2. 10014187 - Cavity package with pre-molded substrate (2018-07-03),

3. 9887149 - Cavity package with die attach pad (2018-02-06),

4. 9659855 - Cavity package with pre-molded substrate (2017-05-23),

5. 9601413 - Cavity package with die attach pad (2017-03-21),

6. 9536812 - Cavity package with pre-molded cavity leadframe (2017-01-03),

7. 9520306 - Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion (2016-12-13),

8. 9484241 - Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding (2016-11-01),

9. 9257370 - Cavity package with pre-molded cavity leadframe (2016-02-09),

10. 8330270 - Integrated circuit package having a plurality of spaced apart pad portions (2012-12-11),

11. 7595225 - Leadless plastic chip carrier with contact standoff (2009-09-29),

12. 7482690 - Electronic components such as thin array plastic packages and process for fabricating same (2009-01-27),

13. 7449771 - Multiple leadframe laminated IC package (2008-11-11),

14. 7439099 - Thin ball grid array package (2008-10-21),

15. 7411289 - Integrated circuit package with partially exposed contact pads and process for fabricating the same (2008-08-12),

Title: Inventor Chun Ho Fan - Revolutionizing Innovation in Hong Kong

Introduction: Chun Ho Fan is a pioneering inventor hailing from Hong Kong, CN, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chun Ho Fan holds several patents in the realm of renewable energy technologies, smart devices, and sustainable materials, showcasing her commitment to creating a more eco-friendly future.

Career Highlights: With a career spanning over two decades, Chun Ho Fan has worked tirelessly to develop cutting-edge solutions that have redefined industries. Her innovative spirit and dedication have earned her recognition as a trailblazer in the field of invention.

Collaborations: Throughout her career, Chun Ho Fan has collaborated with leading research institutions, universities, and tech companies to bring her ideas to life. Her ability to work in diverse teams has led to the successful implementation of numerous groundbreaking projects.

Conclusion: Chun Ho Fan's passion for innovation, coupled with her relentless drive to push boundaries, continues to inspire inventors and entrepreneurs worldwide. Her legacy as a visionary inventor is sure to endure for generations to come.

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