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For the Inventor, By the Inventor

Hong Kong, China

Chun Ho Fan

This inventor holds 51 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: A-Sat Corporation, Ubotic Company Limited, Asm Technology Singapore Pte Ltd. Active years: 2002-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun Ho Fan. Retrieved from https://idiyas.com/inventor/chun-ho-fan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 51 

% Patents Active = 90.2

Average Co-Inventor Count = 2.7

ph-index = 31

Forward Citations = 3,027(Granted Patents)

Forward Citations (Not Self Cited) = 2,963(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hong Kong, CN (2002 - 2018)
  • Tsuen Wan, CN (2016 - 2018)

Company Filing History:

goldMedal40 out of 69 
 
A-Sat Corporation
 patents
silverMedal6 out of 11 
 
Ubotic Company Limited
 patents
bronzeMedal2 out of 234 
 
Asm Technology Singapore Pte Ltd
 patents
4. 1 out of 78 
 
Utac Headquarters Pte. Ltd.
 patents
5. 1 out of 8 
 
Utac Hong Kong Limited
 patents
6. 1 out of 834,513 
Other
 patents

Years Active: 2002-2018

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Areas of Expertise:
Wafer-Level Packaging
Leadless Plastic Chip Carrier
Ball Grid Array
Integrated Circuit Package
Thermal Dissipation
Pre-Molded Substrate
Die Attach Pad
Cavity Package
Thin Array Packages
Thermocompression Bonding
Mold Warping
Pad Frame Fabrication
51 patents (USPTO):Explore Patents
1. 10115579 - Method for manufacturing wafer-level semiconductor packages (2018-10-30),
2. 10014187 - Cavity package with pre-molded substrate (2018-07-03),
3. 9887149 - Cavity package with die attach pad (2018-02-06),
4. 9659855 - Cavity package with pre-molded substrate (2017-05-23),
5. 9601413 - Cavity package with die attach pad (2017-03-21),
6. 9536812 - Cavity package with pre-molded cavity leadframe (2017-01-03),
7. 9520306 - Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion (2016-12-13),
8. 9484241 - Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding (2016-11-01),
9. 9257370 - Cavity package with pre-molded cavity leadframe (2016-02-09),
10. 8330270 - Integrated circuit package having a plurality of spaced apart pad portions (2012-12-11),
11. 7595225 - Leadless plastic chip carrier with contact standoff (2009-09-29),
12. 7482690 - Electronic components such as thin array plastic packages and process for fabricating same (2009-01-27),
13. 7449771 - Multiple leadframe laminated IC package (2008-11-11),
14. 7439099 - Thin ball grid array package (2008-10-21),
15. 7411289 - Integrated circuit package with partially exposed contact pads and process for fabricating the same (2008-08-12),

Title: Inventor Chun Ho Fan - Revolutionizing Innovation in Hong Kong

Introduction: Chun Ho Fan is a pioneering inventor hailing from Hong Kong, CN, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chun Ho Fan holds several patents in the realm of renewable energy technologies, smart devices, and sustainable materials, showcasing her commitment to creating a more eco-friendly future.

Career Highlights: With a career spanning over two decades, Chun Ho Fan has worked tirelessly to develop cutting-edge solutions that have redefined industries. Her innovative spirit and dedication have earned her recognition as a trailblazer in the field of invention.

Collaborations: Throughout her career, Chun Ho Fan has collaborated with leading research institutions, universities, and tech companies to bring her ideas to life. Her ability to work in diverse teams has led to the successful implementation of numerous groundbreaking projects.

Conclusion: Chun Ho Fan's passion for innovation, coupled with her relentless drive to push boundaries, continues to inspire inventors and entrepreneurs worldwide. Her legacy as a visionary inventor is sure to endure for generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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