The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Jul. 29, 2013
Man Chung Chan, Kwai Chung, HK;
Chun Ho Fan, Kwai Chung, HK;
Man Chung Chan, Kwai Chung, HK;
Chun Ho Fan, Kwai Chung, HK;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
Disclosed is a device for holding a plurality of semiconductor devices during thermocompression bonding, comprising: a body; a plurality of support surfaces at a first side of the body, each support surface being configured for holding at least one semiconductor device during thermocompression bonding; and a plurality of internal conduits within the body, each internal conduit extending from an opening of a respective one of the support surfaces at the first side of the body to an opening at a second side of the body. In particular, the openings at the second side of the body are configured to be connected to separate pneumatic paths to be in fluid communication therewith, each pneumatic path having an independently controlled pneumatic suction force so that the openings of the support surfaces at the first side of the body are operative to selectively hold the one or more semiconductor devices against the support surfaces at the first side of the body or to release the same therefrom. An apparatus for holding semiconductor devices during thermocompression bonding, and a method of bonding a plurality of semiconductor devices to a substrate via thermocompression bonding are also disclosed.