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Singapore, Singapore

Asm Technology Singapore Pte Ltd

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USPTO Granted Patents = 234

% Expired Patents = 0.85

EPO Patents = 7

Trademarks = 7

Forward Citations = 774

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354 inventors (with patents filed for the assignee):

Shu Chuen Ho (26 out of 26 patents)

Chi Wah Cheng (25 out of 51 patents)

Ka Shing Kenny Kwan (25 out of 25 patents)

4. Teng Hock Kuah (22 out of 27 patents)

5. Yam Mo Wong (21 out of 21 patents)

6. Gary Peter Widdowson (19 out of 34 patents)

7. Keng Yew Song (18 out of 23 patents)

8. Yu Sze Cheung (13 out of 15 patents)

9. Yue Zhang (10 out of 21 patents)

10. Kui Kam Lam (10 out of 16 patents)

11. Kai Fung Lau (10 out of 11 patents)

12. See Yap Ong (10 out of 10 patents)

13. Ajit S Gaunekar (10 out of 11 patents)

14. Gang Ou (10 out of 11 patents)

15. Ka Shing Kwan (9 out of 14 patents)

Core Competencies:

Wire Bonding

Die Bonding

Optical Alignment

Semiconductor Devices

LED Testing

Particle Removal

Adhesive Dispensing

Device Transfer

Thermal Management

Wafer Processing

3D Imaging

Bonding Apparatus

234 patents: Sort by Forward Citations

1. 11460713 - System and method for aligning multiple lens elements (2022-10-04),

2. 11400495 - Automated particle removal system having angular adjustability (2022-08-02),

3. 11343949 - Apparatus and method for dispensing a viscous adhesive (2022-05-24),

4. 11322374 - Optical station for exchanging optical elements (2022-05-03),

5. 11289446 - Multiple actuator wire bonding apparatus (2022-03-29),

6. 11289445 - Die bonder incorporating rotatable adhesive dispenser head (2022-03-29),

7. 11283978 - Aligning lens elements in a lens module relative to an image sensor (2022-03-22),

8. 11276614 - Testing of LED devices during pick and place operations (2022-03-15),

9. 11239197 - Wire bonding apparatus threading system (2022-02-01),

10. 11227779 - Apparatus and method for processing a semiconductor device (2022-01-18),

11. 11205937 - Driving system having reduced vibration transmission (2021-12-21),

12. 11205634 - Bonding apparatus with replaceable bonding tool (2021-12-21),

13. 11145620 - Formation of bonding wire vertical interconnects (2021-10-12),

14. 11136202 - Direct transfer apparatus for electronic components (2021-10-05),

15. 11121115 - Y-theta table for semiconductor equipment (2021-09-14),

Company Overview

Asm Technology Singapore Pte Ltd specializes in advanced semiconductor packaging solutions, focusing on critical processes such as wire bonding, die bonding, and optical alignment. The company is dedicated to enhancing the performance and reliability of semiconductor devices through innovative technologies, including LED testing, particle removal, adhesive dispensing, and device transfer. Based in Singapore, Asm Technology plays a significant role in the semiconductor industry, contributing to the development of cutting-edge packaging techniques that support the evolving needs of electronics manufacturing.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

234 Patents

#23 in Singapore

#23 in Singapore

#3,673 in the World

Singapore, Singapore

Asm Technology Singapore Pte Ltd

Forward Citations = 774

354 inventors:

Shu Chuen Ho (26 out of 26 patents)

Chi Wah Cheng (25 out of 51 patents)

Ka Shing Kenny Kwan (25 out of 25 patents)

4. Teng Hock Kuah (22 out of 27 patents)

5. Yam Mo Wong (21 out of 21 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Asm Technology Singapore Pte Ltd. Retrieved from https://idiyas.com/company/asm-technology-singapore

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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