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For the Inventor, By the Inventor

Singapore, Singapore

Asm Technology Singapore Pte Ltd


USPTO Granted Patents = 234


Trademarks = 10

Forward Citations = 732

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354 inventors (with patents filed for the assignee):

goldMedal Shu Chuen Ho (26 out of 26 patents)

silverMedal Chi Wah Cheng (25 out of 51 patents)

bronzeMedal Ka Shing Kenny Kwan (25 out of 25 patents)

4.  Teng Hock Kuah (22 out of 26 patents)

5.  Yam Mo Wong (21 out of 21 patents)

6.  Gary Peter Widdowson (19 out of 33 patents)

7.  Keng Yew Song (18 out of 22 patents)

8.  Yu Sze Cheung (13 out of 15 patents)

9.  Yue Zhang (10 out of 20 patents)

10.  Kui Kam Lam (10 out of 16 patents)

11.  Kai Fung Lau (10 out of 11 patents)

12.  See Yap Ong (10 out of 10 patents)

13.  Ajit S Gaunekar (10 out of 11 patents)

14.  Gang Ou (10 out of 11 patents)

15.  Ka Shing Kwan (9 out of 11 patents)


Core Competencies:
Lens Alignment
Particle Removal
Viscous Adhesive Dispensing
Wire Bonding
Semiconductor Processing
Electronic Component Transfer
Bonding Tool Replacement
High-Precision Positioning
Laser Cutting
Confocal Imaging
Die Bonding
Substrate Heating

234 patents:

1. 11460713 - System and method for aligning multiple lens elements (2022-10-04),
2. 11400495 - Automated particle removal system having angular adjustability (2022-08-02),
3. 11343949 - Apparatus and method for dispensing a viscous adhesive (2022-05-24),
4. 11322374 - Optical station for exchanging optical elements (2022-05-03),
5. 11289446 - Multiple actuator wire bonding apparatus (2022-03-29),
6. 11289445 - Die bonder incorporating rotatable adhesive dispenser head (2022-03-29),
7. 11283978 - Aligning lens elements in a lens module relative to an image sensor (2022-03-22),
8. 11276614 - Testing of LED devices during pick and place operations (2022-03-15),
9. 11239197 - Wire bonding apparatus threading system (2022-02-01),
10. 11227779 - Apparatus and method for processing a semiconductor device (2022-01-18),
11. 11205937 - Driving system having reduced vibration transmission (2021-12-21),
12. 11205634 - Bonding apparatus with replaceable bonding tool (2021-12-21),
13. 11145620 - Formation of bonding wire vertical interconnects (2021-10-12),
14. 11136202 - Direct transfer apparatus for electronic components (2021-10-05),
15. 11121115 - Y-theta table for semiconductor equipment (2021-09-14),
ASM Technology Singapore Pte Ltd is a leading provider of advanced semiconductor assembly and packaging solutions. With a strong focus on innovation, ASM Technology Singapore offers a comprehensive range of equipment, materials, and services to the global semiconductor industry. Their expertise in advanced packaging technologies and integrated manufacturing solutions has made them a trusted partner for semiconductor manufacturers worldwide.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

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234 Patents

#23 in Singapore

#23 in Singapore

#3,551 in the World

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Singapore, Singapore

Asm Technology Singapore Pte Ltd

Forward Citations = 732

354 inventors:

goldMedal Shu Chuen Ho (26 out of 26 patents)

silverMedal Chi Wah Cheng (25 out of 51 patents)

bronzeMedal Ka Shing Kenny Kwan (25 out of 25 patents)

4.  Teng Hock Kuah (22 out of 26 patents)

5.  Yam Mo Wong (21 out of 21 patents)

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