The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Mar. 05, 2019
Applicant:
Asm Technology Singapore Pte Ltd, Singapore, SG;
Inventors:
Mow Huat Goh, Singapore, SG;
Jiang Huang, Chengdu, CN;
Ya Ping Zhu, Chengdu, CN;
Chi Kwan Park, Singapore, SG;
Keng Yew Song, Singapore, SG;
Assignee:
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 23/00 (2006.01); B23K 20/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); B23K 20/00 (2013.01); B23K 20/10 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/745 (2013.01); H01L 24/78 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78621 (2013.01);
Abstract
A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.