Chi Kwan Park

Title: Innovations by Chi Kwan Park

Introduction

Chi Kwan Park is a notable inventor based in Singapore, known for his contributions to the field of wire interconnections. With a total of 3 patents, he has made significant advancements in methods related to measuring and forming vertical wire interconnects.

Latest Patents

One of his latest patents is a method for measuring the heights of wire interconnections. This innovative approach involves capturing a top view of a vertical wire interconnection and identifying the position of its tip end. A conductive probe is then lowered towards the tip end until an electrical connection is established, allowing for the determination of the contact height, which corresponds to the height of the vertical wire interconnection. Another significant patent by Park is related to the formation of bonding wire vertical interconnects. This wire bonding method includes extending a length of bonding wire from a capillary, deforming a point on the wire tail to create a weakened portion, and retracting the wire tail into the capillary before bonding it to a substrate.

Career Highlights

Chi Kwan Park has worked with reputable companies such as ASM Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His experience in these organizations has contributed to his expertise in the field of wire interconnections.

Collaborations

Throughout his career, Park has collaborated with talented individuals, including Keng Yew Song and Jiang Huang. These collaborations have likely enriched his work and led to further innovations in his field.

Conclusion

Chi Kwan Park's contributions to the field of wire interconnections through his patents and career experiences highlight his role as an influential inventor. His innovative methods continue to impact the industry positively.