For the Inventor, By the Inventor

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Singapore, Singapore

Asmpt Singapore Pte. Ltd.

USPTO Granted Patents = 29

EPO Patents = 4

Trademarks = 10

Forward Citations = 1

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85 inventors (with patents filed for the assignee):

Keng Yew Song (4 out of 22 patents)

Teng Hock Kuah (4 out of 26 patents)

Kar Weng Yan (3 out of 6 patents)

4. Mow Huat Goh (3 out of 5 patents)

5. Hei Lam Chang (3 out of 4 patents)

6. Po Lam Au (3 out of 3 patents)

7. Yi Yu Lin (2 out of 5 patents)

8. Ka Shing Kwan (2 out of 11 patents)

9. Jun Qi (2 out of 4 patents)

10. Jiangwen Deng (2 out of 12 patents)

11. Chi Wah Cheng (2 out of 51 patents)

12. Tsz Kit Yu (2 out of 2 patents)

13. Kwok Pun Law (2 out of 2 patents)

14. Zui Hong Lee (2 out of 2 patents)

15. Kien Kia Tan (2 out of 2 patents)

29 patents: Sort by Forward Citations

1. 12510451 - Method and apparatus for conducting shear tests on interconnect bonds (2025-12-30),

2. 12492893 - Passive alignment of lens module relative to an image sensor for manufacturing a camera module (2025-12-09),

3. 12457399 - Camera module assembly (2025-10-28),

4. 12442744 - Apparatus and method for calibrating a shear test tool (2025-10-14),

5. 12396084 - Dielectric barrier discharge plasma generator (2025-08-19),

6. 12392390 - Apparatus and method for vibration attenuation (2025-08-19),

7. 12304002 - Laser-cutting using selective polarization (2025-05-20),

8. 12304001 - Optimised laser cutting (2025-05-20),

9. 12081868 - Aligning optical components along a predetermined reference optical path (2024-09-03),

10. 12072251 - Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device (2024-08-27),

11. 12020959 - Detape apparatus for an optical alignment machine (2024-06-25),

12. 11955347 - Encapsulation process for double-sided cooled packages (2024-04-09),

13. 11842978 - Wire bonding system including a wire biasing tool (2023-12-12),

14. 11798911 - Force sensor in an ultrasonic wire bonding device (2023-10-24),

15. 11776930 - Die bond head apparatus with die holder motion table (2023-10-03),

ASMPT SINGAPORE PTE. LTD. is a subsidiary of ASM Pacific Technology, one of the world's leading suppliers of semiconductor assembly and packaging equipment. The company offers a wide range of cutting-edge products and solutions for the global semiconductor industry. Leveraging advanced technology and a commitment to innovation, ASMPT Singapore provides customers with high-quality, reliable equipment that enables the production of chips used in various electronic devices. With a strong presence in the Singapore market, the company aims to contribute to the growth and development of the semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

29 Patents

#91 in Singapore

#91 in Singapore

#21,866 in the World

Singapore, Singapore

Asmpt Singapore Pte. Ltd.

Forward Citations = 1

85 inventors:

Keng Yew Song (4 out of 22 patents)

Teng Hock Kuah (4 out of 26 patents)

Kar Weng Yan (3 out of 6 patents)

4. Mow Huat Goh (3 out of 5 patents)

5. Hei Lam Chang (3 out of 4 patents)

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