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For the Inventor, By the Inventor

Singapore, Singapore

Asmpt Singapore Pte. Ltd.


USPTO Granted Patents = 36


Trademarks = 8

Forward Citations = 2

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104 inventors (with patents filed for the assignee):

goldMedal Keng Yew Song (5 out of 23 patents)

silverMedal Teng Hock Kuah (5 out of 27 patents)

bronzeMedal Ka Shing Kwan (4 out of 13 patents)

4.  Yi Yu Lin (3 out of 6 patents)

5.  Kar Weng Yan (3 out of 6 patents)

6.  Mow Huat Goh (3 out of 5 patents)

7.  Hei Lam Chang (3 out of 4 patents)

8.  Tsz Kit Yu (3 out of 3 patents)

9.  Po Lam Au (3 out of 3 patents)

10.  Yue Zhang (2 out of 21 patents)

11.  Jiapei Ding (2 out of 5 patents)

12.  Jian Liao (2 out of 3 patents)

13.  Jun Qi (2 out of 4 patents)

14.  Jiangwen Deng (2 out of 12 patents)

15.  Chi Wah Cheng (2 out of 51 patents)


Core Competencies:
Ultrasonic Transducer
Thermocompression Bonding
Fluxless Bonding
Camera Module Assembly
Laser Cutting
Optical Alignment
Wire Bonding
Encapsulation Process
Sintering Tool
Pick and Place Apparatus
Force Measurement Device
Mechanical Press Testing

36 patents:

1. 12703041 - Ultrasonic transducer operable at multiple resonant frequencies (2026-08-11),
2. 12702038 - System and method for fluxless thermocompression bonding (2026-08-04),
3. 12699316 - Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process (2026-08-04),
4. 12696783 - Handling a fragile substrate for interconnect bonding (2026-07-28),
5. 12599022 - Apparatus for applying a sintering force via a compressible film (2026-04-07),
6. 12533818 - Pick-up chuck with gas bearing structure (2026-01-27),
7. 12525571 - Compliant locating structure for a bond head assembly (2026-01-13),
8. 12510451 - Method and apparatus for conducting shear tests on interconnect bonds (2025-12-30),
9. 12492893 - Passive alignment of lens module relative to an image sensor for manufacturing a camera module (2025-12-09),
10. 12457399 - Camera module assembly (2025-10-28),
11. 12442744 - Apparatus and method for calibrating a shear test tool (2025-10-14),
12. 12396084 - Dielectric barrier discharge plasma generator (2025-08-19),
13. 12392390 - Apparatus and method for vibration attenuation (2025-08-19),
14. 12304002 - Laser-cutting using selective polarization (2025-05-20),
15. 12304001 - Optimised laser cutting (2025-05-20),
Company Overview
Asmpt Singapore Pte. Ltd. is a prominent player in the semiconductor and electronics manufacturing sectors, specializing in advanced packaging solutions and automation technologies. The company focuses on developing innovative systems that enhance the efficiency and performance of semiconductor production processes. With a strong emphasis on research and development, Asmpt is dedicated to driving technological advancements in the industry, contributing to the evolution of electronic devices globally.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

36 Patents

#82 in Singapore

#82 in Singapore

#18,716 in the World

Singapore, SG
Singapore, Singapore

Asmpt Singapore Pte. Ltd.

Forward Citations = 2

104 inventors:

goldMedal Keng Yew Song (5 out of 23 patents)

silverMedal Teng Hock Kuah (5 out of 27 patents)

bronzeMedal Ka Shing Kwan (4 out of 13 patents)

4.  Yi Yu Lin (3 out of 6 patents)

5.  Kar Weng Yan (3 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Asmpt Singapore Pte. Ltd.. Retrieved from https://idiyas.com/company/asmpt-singapore

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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