The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Apr. 21, 2023
Applicant:
Asmpt Singapore Pte. Ltd., Singapore, SG;
Inventors:
Keng Yew Song, Singapore, SG;
Zui Hong Lee, Singapore, SG;
Jian Min Chen, Chengdu, CN;
Mow Huat Goh, Singapore, SG;
Kien Kia Tan, Singapore, SG;
Assignee:
ASMPT Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 3/24 (2006.01); G06T 7/00 (2017.01); G06T 7/246 (2017.01); G06T 7/60 (2017.01);
U.S. Cl.
CPC ...
G01N 3/24 (2013.01); G06T 7/0004 (2013.01); G06T 7/246 (2017.01); G06T 7/60 (2013.01); G06T 2207/30108 (2013.01);
Abstract
A shear test is conducted on an interconnect bond formed on a surface of an electronic device by first determining a profile of the surface, and based on the determined profile, determining a shearing path which is at a substantially constant distance from the profile of the surface for a shear test tool to conduct the shear test on the interconnect bond. The shear test tool is then guided to move along the determined shearing path to measure a shear force of the interconnect bond.