Location History:
- Johor, MY (2010)
- Singapore, SG (2021 - 2023)
Company Filing History:
Years Active: 2010-2025
Title: Mow Huat Goh: A Pioneering Inventor in Wire Bonding Technology
Introduction
Mow Huat Goh is a notable inventor based in Singapore, recognized for his significant contributions to the field of wire bonding technology. With three patents to his name, Goh has developed innovative methods that enhance the efficiency and precision of wire interconnections. His work plays a crucial role in modern electronics, where reliability and performance are paramount.
Latest Patents
Mow Huat Goh's latest patents embody advanced techniques in measuring and forming wire interconnections. The first patent, "Method for measuring the heights of wire interconnections," describes a process that captures the top view of a vertical wire interconnection and employs a conductive probe to accurately determine its height. This innovation is essential for ensuring high-performance connections in electronic devices.
The second patent, "Formation of bonding wire vertical interconnects," outlines a unique wire bonding method that involves extending and deforming a bonding wire to create a weakened portion before bonding it to a substrate. This technique maximizes bonding precision and enhances the durability of connections, showcasing Goh's commitment to advancing wire bonding technologies.
Career Highlights
Throughout his career, Mow Huat Goh has worked with leading companies in the technology sector, including ASM Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His experience in these organizations has allowed him to refine his skills and push the boundaries of innovation in the field of wire interconnections.
Collaborations
Goh has collaborated with remarkable professionals in the industry, including Jiang Huang and Ya Ping Zhu. These partnerships have facilitated the exchange of ideas and fostered advancements in the technology that supports modern electronics, highlighting Goh's collaborative spirit in research and development.
Conclusion
Mow Huat Goh's inventive contributions to wire bonding technology underscore his importance as an inventor in Singapore. His patents reflect a deep understanding of the challenges faced in the industry and showcase innovative solutions that pave the way for future advancements. As technology continues to evolve, Goh's work remains instrumental in shaping the landscape of electronic interconnections.