The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Jul. 22, 2022
Applicant:

Asmpt Singapore Pte. Ltd., Singapore, SG;

Inventors:

Jiapei Ding, Singapore, SG;

Teng Hock Kuah, Singapore, SG;

Bin Yuan, Singapore, SG;

Yi Lin, Singapore, SG;

Jian Liao, Singapore, SG;

Assignee:

ASMPT SINGAPORE PTE. LTD., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/75 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/8384 (2013.01);
Abstract

A sintering apparatus for simultaneously sintering an electronic device onto a substrate, and a metallic sheet onto the electronic device includes a sinter tool and a compressible film positionable onto the metallic sheet and the electronic device. A thickness of the compressible film is greater than a height of the metallic sheet. The compressible film is adapted to conform to a shape of the metallic sheet and the electronic device to simultaneously cover the metallic sheet and at least a part of the electronic device when the sinter tool applies a sintering force onto the compressible film during a sintering process.


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