Singapore, Singapore

Teng Hock Kuah

USPTO Granted Patents = 26 

 

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 116(Granted Patents)


Company Filing History:


Years Active: 2003-2024

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26 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Teng Hock Kuah in the Semiconductor Industry**

Introduction

Teng Hock Kuah is an accomplished inventor based in Singapore, recognized for his significant contributions to the field of semiconductor technology. With a total of 26 patents to his name, he has demonstrated a remarkable capacity for innovation and problem-solving in various aspects of electronic device packaging and bonding.

Latest Patents

Among his latest patents, Teng has developed an "Encapsulation process for double-sided cooled packages." This invention focuses on efficiently encapsulating electronic devices that are mounted on a substrate, featuring a cooling plate in direct contact with those devices. The method utilizes a two-part mold system to achieve precise molding and sealing pressure, ensuring optimal protection and performance of the electronic components.

Another notable patent is the "Flexible sinter tool for bonding semiconductor devices." This apparatus comprises a seal plate with both rigid and flexible elements, allowing for the effective bonding of semiconductor devices onto substrates. The design incorporates a fluid pressure generator that activates a diaphragm, facilitating the application of necessary bonding force during the process, thereby enhancing reliability and efficiency in semiconductor fabrication.

Career Highlights

Teng Hock Kuah has made substantial contributions to leading organizations in the semiconductor sector, including ASM Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His work in these companies underscores his expertise in semiconductor manufacturing and innovation, positioning him as a key player in advancing technology in the industry.

Collaborations

Throughout his career, Teng has collaborated with esteemed colleagues such as Shu Chuen Ho and See Yap Ong. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies in the semiconductor field.

Conclusion

In conclusion, Teng Hock Kuah stands out as a prominent inventor in the semiconductor industry. With his numerous patents and innovative contributions, he continues to influence the landscape of electronic device technology. His work not only enhances device performance but also supports advancements in the broader scope of semiconductor applications.

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