This inventor holds 27 USPTO granted patents and 5 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Asm Technology Singapore Pte Ltd, Asmpt Singapore Pte. Ltd.. Active years: 2003-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003-2026
Areas of Expertise:
Title: **Innovative Contributions of Teng Hock Kuah in the Semiconductor Industry**
Introduction
Teng Hock Kuah is an accomplished inventor based in Singapore, recognized for his significant contributions to the field of semiconductor technology. With a total of 26 patents to his name, he has demonstrated a remarkable capacity for innovation and problem-solving in various aspects of electronic device packaging and bonding.
Latest Patents
Among his latest patents, Teng has developed an "Encapsulation process for double-sided cooled packages." This invention focuses on efficiently encapsulating electronic devices that are mounted on a substrate, featuring a cooling plate in direct contact with those devices. The method utilizes a two-part mold system to achieve precise molding and sealing pressure, ensuring optimal protection and performance of the electronic components.
Another notable patent is the "Flexible sinter tool for bonding semiconductor devices." This apparatus comprises a seal plate with both rigid and flexible elements, allowing for the effective bonding of semiconductor devices onto substrates. The design incorporates a fluid pressure generator that activates a diaphragm, facilitating the application of necessary bonding force during the process, thereby enhancing reliability and efficiency in semiconductor fabrication.
Career Highlights
Teng Hock Kuah has made substantial contributions to leading organizations in the semiconductor sector, including ASM Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His work in these companies underscores his expertise in semiconductor manufacturing and innovation, positioning him as a key player in advancing technology in the industry.
Collaborations
Throughout his career, Teng has collaborated with esteemed colleagues such as Shu Chuen Ho and See Yap Ong. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies in the semiconductor field.
Conclusion
In conclusion, Teng Hock Kuah stands out as a prominent inventor in the semiconductor industry. With his numerous patents and innovative contributions, he continues to influence the landscape of electronic device technology. His work not only enhances device performance but also supports advancements in the broader scope of semiconductor applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile