The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
Jun. 25, 2004
Shu C Ho, Singapore, SG;
Teng H Kuah, Singapore, SG;
Zhi P Zhang, Singapore, SG;
Shuai G Lee, Singapore, SG;
Chun Y LI, Singapore, SG;
Yi Lin, Singapore, SG;
Shu C Ho, Singapore, SG;
Teng H Kuah, Singapore, SG;
Zhi P Zhang, Singapore, SG;
Shuai G Lee, Singapore, SG;
Chun Y Li, Singapore, SG;
Yi Lin, Singapore, SG;
ASM Technology Singapore Pte Ltd., Singapore, SG;
Abstract
A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.