The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Mar. 07, 2016
Asm Technology Singapore Pte Ltd, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
Chee Toh Teh, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Kai Wu, Singapore, SG;
Chin Chong Lee, Singapore, SG;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open. The base vacuum pump and the reservoir vacuum pump are each operative to reduce a pressure of the cavity pressure zone to the molding process pressure when they are in fluid communication with the cavity pressure zone.