Chee Toh Teh

Title: Innovations by Chee Toh Teh

Introduction

Chee Toh Teh is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He holds two patents that showcase his innovative approach to electronic device encapsulation and molding processes.

Latest Patents

One of his latest patents is a "Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump." This invention involves a semiconductor encapsulation apparatus designed to encapsulate a semiconductor device on a substrate. The apparatus features a mold with a cavity pressure zone that maintains a specific molding process pressure. It includes a base vacuum pump conduit and a reservoir vacuum pump conduit, both of which work to reduce the pressure in the cavity pressure zone during the molding process.

Another significant patent is the "Modular molding assembly for electronic devices." This modular assembly consists of an input module for loading electronic devices, a press station with molding presses, and an output module for offloading the molded devices. The assembly includes a movable carrier with an adaptor for attaching different modules that perform various functions, such as transporting devices or introducing molding compounds.

Career Highlights

Chee Toh Teh is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop innovative solutions in the field of semiconductor technology. His work has significantly impacted the efficiency and effectiveness of electronic device manufacturing.

Collaborations

He collaborates with talented coworkers, including Shu Chuen Ho and Teng Hock Kuah, who contribute to the innovative environment at Asm Technology Singapore Pte Ltd.

Conclusion

Chee Toh Teh's contributions to semiconductor technology through his patents reflect his commitment to innovation and excellence in the field. His work continues to influence the development of advanced electronic devices.