The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Feb. 05, 2010
Shu Chuen Ho, Singapore, SG;
Jian Wu, Singapore, SG;
Choon Hong Cheong, Singapore, SG;
Chee Toh Teh, Singapore, SG;
Fu Sun Huang, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Jian Wu, Singapore, SG;
Choon Hong Cheong, Singapore, SG;
Chee Toh Teh, Singapore, SG;
Fu Sun Huang, Singapore, SG;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
A modular molding assembly comprises an input module for loading electronic devices for molding, a press station including one or more molding presses for molding the electronic devices, an output module for offloading molded electronic devices after they have been molded and a carrier that is movable at least between the input module and the press station and/or the press station and the output module. The carrier has an adaptor located thereon for detachably mounting a first attachment or a second attachment which is operative to perform a function of transporting the electronic devices and/or introducing a molding compound to the press station for conducting molding. The first and second attachments each has a corresponding mounting device for detachably mounting the first or second attachment onto the adapter and the first attachment has a different function from the second attachment.