Fu Sun Huang

Title: Innovations of Fu Sun Huang in Electronic Device Molding

Introduction

Fu Sun Huang is a notable inventor based in Singapore, recognized for his contributions to the field of electronic device manufacturing. He holds a patent that showcases his innovative approach to modular molding assemblies, which are essential for the efficient production of electronic devices.

Latest Patents

Huang's most recent patent is titled "Modular molding assembly for electronic devices." This invention features a modular design that includes an input module for loading electronic devices, a press station with multiple molding presses, and an output module for offloading the molded devices. The assembly is equipped with a movable carrier that can transport devices between the input and press stations. Additionally, the carrier has an adaptor for attaching different functional components, allowing for versatility in transporting devices and introducing molding compounds.

Career Highlights

Fu Sun Huang is currently employed at Asm Technology Singapore Pte Ltd, where he applies his expertise in molding technology. His work has significantly impacted the efficiency and effectiveness of electronic device manufacturing processes.

Collaborations

Huang collaborates with talented colleagues, including Shu Chuen Ho and Jian Wu, who contribute to the innovative environment at Asm Technology Singapore Pte Ltd.

Conclusion

Fu Sun Huang's innovative work in modular molding assemblies exemplifies the advancements in electronic device manufacturing. His contributions are vital to the ongoing evolution of technology in this field.