The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
May. 09, 2007
Ji Yuan Hao, Singapore, SG;
See Yap Ong, Singapore, SG;
Jian Xiong Su, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
EE Ling Chiw, Singapore, SG;
Ji Yuan Hao, Singapore, SG;
See Yap Ong, Singapore, SG;
Jian Xiong Su, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
Ee Ling Chiw, Singapore, SG;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.