Singapore, Singapore

Ji Yuan Hao

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2011-2023

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Ji Yuan Hao

Introduction

Ji Yuan Hao is a notable inventor based in Singapore, recognized for his contributions to the field of molding systems and electronic device encapsulation. With a total of 5 patents to his name, he has made significant advancements in technology that enhance manufacturing processes.

Latest Patents

One of Ji Yuan Hao's latest patents is an "Apparatus and method for removing a film from a surface." This invention addresses the challenge of removing a used release film from a molding system after the substrate has been molded. The system employs a gripper assembly that is movable between a retracted position and an extended position, allowing for efficient removal of the film. Another significant patent is the "Molding system for applying a uniform clamping pressure onto a substrate." This invention features a molding system designed to encapsulate electronic devices mounted on a substrate, utilizing sensors and actuators to ensure a uniform clamping pressure is applied.

Career Highlights

Throughout his career, Ji Yuan Hao has worked with prominent companies such as Asm Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His experience in these organizations has contributed to his expertise in molding technologies and electronic device manufacturing.

Collaborations

Ji Yuan Hao has collaborated with notable colleagues, including Teng Hock Kuah and See Yap Ong. These partnerships have likely fostered innovation and the development of advanced technologies in their respective fields.

Conclusion

Ji Yuan Hao's innovative patents and career achievements highlight his significant role in advancing molding technologies. His work continues to impact the manufacturing industry positively.

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