The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Oct. 14, 2009
Shu Chuen Ho, Singapore, SG;
Teng Hock Eric Kuah, Singapore, SG;
Ji Yuan Hao, Singapore, SG;
EE Ling Chiw, Singapore, SG;
See Yap Ong, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Teng Hock Eric Kuah, Singapore, SG;
Ji Yuan Hao, Singapore, SG;
Ee Ling Chiw, Singapore, SG;
See Yap Ong, Singapore, SG;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding.