The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Jul. 15, 2010
Teng Hock Kuah, Singapore, SG;
See Yap Ong, Singapore, SG;
Ji Yuan Hao, Singapore, SG;
Kai Wu, Singapore, SG;
EE Ling Chiw, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
See Yap Ong, Singapore, SG;
Ji Yuan Hao, Singapore, SG;
Kai Wu, Singapore, SG;
Ee Ling Chiw, Singapore, SG;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant.