Jian Xiong Su

Title: Innovations of Jian Xiong Su

Introduction

Jian Xiong Su is a notable inventor based in Singapore, known for his contributions to the field of semiconductor technology. He holds 2 patents that showcase his innovative approach to molding processes in electronic device manufacturing.

Latest Patents

His latest patents include a molding press and a platen for a molding press. The platen is designed for encapsulating semiconductor dies on a substrate. It features a first mold chase with a surface that cooperates with a second mold chase to clamp a substrate. This design allows for the definition of at least one mold cavity with respect to the substrate. Additionally, the platen includes a rotational mounting device that enables the first or second mold chase to rotate, adjusting the arrangement of the mold chase surfaces. Another significant patent involves a compression molding system for electronic devices, which incorporates first and second mold halves. This system is equipped with plungers that apply a compacting force to encapsulation material during the molding process.

Career Highlights

Jian Xiong Su is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop innovative solutions in semiconductor manufacturing. His work has significantly impacted the efficiency and effectiveness of molding processes in the industry.

Collaborations

He collaborates with talented coworkers, including Teng Hock Kuah and Shu Chuen Ho, who contribute to the innovative environment at Asm Technology Singapore Pte Ltd.

Conclusion

Jian Xiong Su's contributions to the field of semiconductor technology through his patents and work at Asm Technology Singapore Pte Ltd highlight his role as a significant inventor in the industry. His innovative designs continue to advance the capabilities of electronic device manufacturing.