Singapore, Singapore

Jian Liao

This inventor holds 3 USPTO granted patents and 1 EPO patent. Top assignees: Asmpt Singapore Pte. Ltd., Asm Technology Singapore Pte Ltd. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jian Liao. Retrieved from https://idiyas.com/inventor/jian-liao-mz9jrf9c

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 66.7

 

Average Co-Inventor Count = 5.8

ph-index = 1


Company Filing History:


Years Active: 2022-2026

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3 patents (USPTO):Explore Patents

Title: **Inventor Jian Liao: Pioneering Innovations in Semiconductor Technology**

Introduction

Jian Liao is a distinguished inventor based in Singapore, recognized for his key contributions to the field of semiconductor technology. With a total of two innovative patents to his name, Jian has showcased his expertise in crafting advanced solutions that enhance the bonding and processing of semiconductor devices.

Latest Patents

Jian's latest patents reflect his commitment to pushing the boundaries of technology. The first patent, titled **Flexible Sinter Tool for Bonding Semiconductor Devices**, introduces an innovative apparatus designed to bond semiconductor devices onto substrates effectively. The apparatus features a seal plate with both rigid and flexible components, allowing for variable pressure application that optimally contacts substrates.

His second patent, **Apparatus and Method for Processing a Semiconductor Device**, encompasses a dual-tool system that enables precise handling and force application to semiconductor devices. This invention allows for the spacer to tilt, ensuring effective pressure distribution during the bonding process, thus enhancing the quality and reliability of the device connections.

Career Highlights

Throughout his career, Jian has worked with notable companies in the semiconductor industry, including ASM Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His experience in these organizations has been instrumental in developing cutting-edge technologies that are essential in the manufacturing of semiconductor products.

Collaborations

In his professional journey, Jian has collaborated with esteemed colleagues such as Jiapei Ding and Kar Weng Yan. These collaborations have fostered a collaborative environment that encourages innovation and problem-solving, contributing significantly to the success of their projects.

Conclusion

Jian Liao's contributions to semiconductor technology through his innovative patents have positioned him as a valuable asset in the field. His work not only demonstrates his technical proficiency but also highlights the importance of collaboration in driving advancements that cater to the growing demands of the electronics industry. With his ongoing commitment to innovation, Jian Liao is sure to continue making significant strides in the semiconductor sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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