The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Dec. 09, 2022
Asmpt Singapore Pte. Ltd., Singapore, SG;
ASMPT SINGAPORE PTE. LTD., Singapore, SG;
Abstract
A bonding apparatus has a bonding platform including a top plate for supporting a fragile semiconductor substrate during interconnect bonding operations conducted on the substrate. Vacuum holes situated on the top plate, forming a first vacuum section, a second vacuum section, and a third vacuum section located between the first and second vacuum sections, generate vacuum suction forces on the substrate during bonding. Individually controllable first, second and third vacuum supplies are connected to the first, second and third vacuum sections respectively. The first and second vacuum supplies cooperate at a first bonding position to generate a vacuum suction force at the first and second vacuum sections, and the second and third vacuum supplies cooperate at a second bonding to position to generate a vacuum suction force at the second and third vacuum sections.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile