logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12699316 B1

PDFFull Text
Date of Patent:
Aug. 04, 2026

Filed:

Feb. 08, 2023

Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process

Applicant:

Asmpt Singapore Pte. Ltd., Singapore, SG;

Inventors:

Kai Siu Lam, Hong Kong, CN;

Nim Tak Wong, Hong Kong, CN;

Xiaodong Chen, Hong Kong, CN;

Kui Kam Lam, Hong Kong, CN;

Assignee:

ASMPT SINGAPORE PTE. LTD., Singapore, SG;

Attorney:

OSTROLENK FABER LLP

Primary Examiner:

Abbas Rashid

Assistant Examiner:

Adrianna N Konves

Int. Cl.
CPC ...
G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); G03F 7/70616 (2013.01); G03F 7/70716 (2013.01); G03F 7/70775 (2013.01); G03F 7/70825 (2013.01); G03F 7/70975 (2013.01);
Abstract

An apparatus for applying an adhesive fluid onto a bonding surface during a bonding process includes a positioning table, a dispensing device, a stamping device and a switching member which are mounted on the positioning table. The dispensing device is configured to be positionable by the positioning table to dispense the adhesive fluid onto the bonding surface. The stamping device is configured to be positionable by the positioning table to stamp the adhesive fluid onto the bonding surface. The dispensing device and stamping device are operative to apply the adhesive fluid onto different bonding positions on the bonding surface. The switching member coupled to the stamping device is configured to move the stamping device to a first standby position when the dispensing device is dispensing the adhesive fluid and to a second standby position when the stamping device is stamping the adhesive fluid.

Find Patent Forward Citations

Lam, Kai. (2026). Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process (U.S. Patent No. 12699316). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12699316

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…