Hong Kong, China

Kai Siu Lam

This inventor holds 1 USPTO granted patent. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kai Siu Lam. Retrieved from https://idiyas.com/inventor/kai-siu-lam-z22wldfp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kai Siu Lam and Adhesive-Application Technology.

Introduction

Kai Siu Lam is an inventor associated with Hong Kong, CN. His work includes an invention designed to apply adhesive fluid at different bonding positions during a bonding process.

Latest Patents

The patent provided for Lam is “Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process.” It describes an apparatus with a positioning table, a dispensing device, a stamping device, and a switching member. The positioning table positions the dispensing device to dispense adhesive onto a bonding surface and positions the stamping device to stamp adhesive onto that surface. The two devices apply adhesive at different bonding positions. The switching member moves the stamping device between standby positions according to which device is operating. Lam is listed with 1 patent.

Career Highlights

Lam is associated with Asmpt Singapore Pte. Ltd. The patent’s described approach combines dispensing and stamping functions to support adhesive application at multiple bonding positions.

Collaborations

The coworkers identified in the provided information are Nim Tak Wong and Xiaodong Chen. No further details about their roles or specific collaborations are provided.

Conclusion

Kai Siu Lam’s listed patent focuses on coordinating dispensing and stamping devices to apply adhesive fluid at different positions during a bonding process.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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