Hong Kong, China

Kui Kam Lam

This inventor holds 1 USPTO granted patent. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kui Kam Lam. Retrieved from https://idiyas.com/inventor/kui-kam-lam-vdndke38

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kui Kam Lam: An Inventor in Adhesive-Application Technology

Introduction

Kui Kam Lam is an inventor associated with Hong Kong, CN, and Asmpt Singapore Pte. Ltd. His patent work addresses equipment and methods for applying adhesive fluid during bonding processes. The available information lists 1 patent for him.

Latest Patents

Lam’s listed patent is “Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process.” It describes an apparatus with a positioning table, a dispensing device, a stamping device, and a switching member. The positioning table positions the dispensing and stamping devices to apply adhesive fluid at different bonding positions. The switching member moves the stamping device between standby positions, allowing it to remain clear while the dispensing device operates and to be positioned for stamping when needed.

Career Highlights

The patent reflects Lam’s work on coordinating dispensing and stamping operations in a bonding process. By combining these functions in a positionable apparatus, the invention is designed to apply adhesive fluid at multiple locations on a bonding surface.

Collaborations

Lam is associated with Asmpt Singapore Pte. Ltd. His listed coworkers include Kai Siu Lam and Nim Tak Wong.

Conclusion

Kui Kam Lam’s listed patent focuses on an integrated approach to dispensing and stamping adhesive fluid, highlighting his contribution to bonding-process equipment.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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