The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Apr. 10, 2023
Asmpt Singapore Pte. Ltd., Singapore, SG;
Zetao MA, Hong Kong, CN;
Ming Li, Hong Kong, CN;
Chun Ho Fan, Hong Kong, CN;
Kin Yik Hung, Hong Kong, CN;
Siu Wing Lau, Hong Kong, CN;
ASMPT Singapore Pte. Ltd., Singapore, SG;
Abstract
A bonding system for bonding an electronic component to a base member includes a first container for forming a first inert environment where the base member is locatable during bonding of the electronic component. A first plasma cleaning device is located in the first container to clean the electronic component and/or the base member by removing metal oxides therefrom. A second plasma cleaning device is also provided to clean the electronic component by removing organic contaminants therefrom before the electronic component is conveyed into the first container. A bond head is movably installed in the first container to bond the electronic component to the base member after the electronic component and/or the base member have been cleaned by the first plasma cleaning device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile