This inventor holds 1 USPTO granted patent. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Siu Wing Lau: Patent Inventor in Electronic Component Bonding
Introduction
Siu Wing Lau is an inventor associated with Hong Kong, CN, and ASMPT Singapore Pte. Ltd. His patent work concerns semiconductor packaging and the bonding of electronic components.
Latest Patents
The available information lists one patent associated with Lau: System and Method for Fluxless Thermocompression Bonding. The invention describes a system that bonds an electronic component to a base member in an inert environment. Plasma-cleaning devices remove metal oxides from the component or base member and organic contaminants from the component before bonding. A movable bond head then joins the cleaned component and base member.
Career Highlights
Lau’s listed patent reflects work on improving thermocompression bonding through contaminant removal and controlled processing conditions. The system is designed to support fluxless bonding by preparing the surfaces before the components are joined.
Collaborations
The provided information identifies ASMPT Singapore Pte. Ltd. as Lau’s company and lists Zetao Ma and Ming Li as coworkers. These details indicate professional connections in the electronic packaging and bonding field.
Conclusion
Siu Wing Lau’s listed invention focuses on plasma cleaning and inert-environment processing to enable fluxless thermocompression bonding of electronic components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile