This inventor holds 1 USPTO granted patent. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chun Ho Fan and Fluxless Thermocompression Bonding
Introduction
Chun Ho Fan is an inventor associated with Hong Kong, China, and Asmpt Singapore Pte. Ltd. His patent work concerns semiconductor packaging and the bonding of electronic components.
Latest Patents
Fan is listed as an inventor on 1 patent: “System and Method for Fluxless Thermocompression Bonding.” The invention describes a system for bonding an electronic component to a base member in an inert environment. Plasma-cleaning devices remove metal oxides from the component or base member and organic contaminants from the component before bonding. A movable bond head then joins the cleaned component to the base member.
Career Highlights
Fan’s listed patent reflects work on improving thermocompression bonding through contaminant removal and controlled processing conditions. The patent identifies Asmpt Singapore Pte. Ltd. as his associated company.
Collaborations
The provided information names Zetao Ma and Ming Li as Fan’s coworkers. It does not specify their roles in the patent or describe particular collaborative projects.
Conclusion
Chun Ho Fan’s recorded invention focuses on fluxless thermocompression bonding, using plasma cleaning and an inert environment to support electronic-component assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile