Ming Li

Title: Ming Li and Fluxless Thermocompression Bonding

Introduction

Ming Li is an inventor associated with Hong Kong, China, and ASMPT Singapore Pte. Ltd. His patent work includes a system and method for fluxless thermocompression bonding, a process designed to clean and bond electronic components in controlled conditions.

Latest Patents

The provided information identifies one patent associated with Ming Li: “System and method for fluxless thermocompression bonding.” The invention describes a bonding system that uses a first container to maintain an inert environment around a base member during bonding. A plasma cleaning device in the container removes metal oxides from the electronic component and/or base member. A second plasma cleaning device removes organic contaminants from the electronic component before it enters the container. A movable bond head then bonds the cleaned component to the base member. This approach integrates contaminant removal and bonding within a coordinated system. Li is credited with 1 patent in the information provided.

Career Highlights

Li’s listed patent is associated with ASMPT Singapore Pte. Ltd., a company involved in semiconductor and electronics manufacturing technologies. The patent focuses on improving the preparation and bonding of electronic components by addressing both metal oxides and organic contaminants.

Collaborations

The provided information lists Zetao Ma and Chun Ho Fan as Li’s coworkers. Their names are included as professional associations, though specific roles or contributions to the patent are not stated.

Conclusion

Ming Li’s documented invention brings plasma cleaning and thermocompression bonding together in a controlled process, highlighting a practical approach to preparing electronic components for reliable bonding.