The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Jan. 06, 2020
Applicant:

Asm Technology Singapore Pte Ltd, Singapore, SG;

Inventors:

Kui Kam Lam, Hong Kong, HK;

Kai Siu Lam, Hong Kong, HK;

Yen Hsi Tang, Hong Kong, HK;

Hung Kit Chan, Hong Kong, HK;

Ka Yee Mak, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B65G 47/90 (2006.01); H01L 21/683 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
B65G 47/90 (2013.01); H01L 21/677 (2013.01); H01L 21/67132 (2013.01); H01L 21/67259 (2013.01); H01L 21/67721 (2013.01); H01L 21/6836 (2013.01);
Abstract

Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.


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