The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Mar. 13, 2018
Applicant:

Asm Technology Singapore Pte Ltd, Singapore, SG;

Inventors:

Chi Wah Cheng, Hong Kong, HK;

Wan Yin Yau, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); B05C 5/02 (2006.01); B05B 1/34 (2006.01); H01L 21/67 (2006.01); B05C 11/10 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0469 (2013.01); B05B 1/34 (2013.01); B05C 5/0225 (2013.01); B05C 11/1034 (2013.01); H01L 21/6715 (2013.01); H01L 21/67023 (2013.01);
Abstract

An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.


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