The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Nov. 27, 2019
Applicant:

Asm Technology Singapore Pte Ltd, Singapore, SG;

Inventors:

Keng Yew Song, Singapore, SG;

Yue Zhang, Singapore, SG;

Xiao Liang Chen, Singapore, SG;

Yao Tong, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 20/007 (2013.01); B23K 2101/40 (2018.08); H01L 2224/78611 (2013.01);
Abstract

A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.


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